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The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-inPolymer) are two major packaging trends in this area. Mold embedding...
Medical devices with embedded highly miniaturized microsystems are used as implants in the human body or as non-invasive devices for sensor applications outside the body. Those devices bear quite a lot of economic opportunities but they also do offer unique challenges compared to consumer or automotive applications. Medical applications need to provide biocompatibility, highest miniaturization, rough...
During the last years, jetting processes for higher viscosity materials have gained widespread interest in microelectronics manufacturing. Main reasons for this interest are high throughput/productivity of jetting, contactless material deposition, high volume precision and freely designable deposition patterns. Especially the higher viscosity materials are of interest for the integration of a variety...
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