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The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies that also allow large area processing and 3D integration with strong potential for low cost applications. Here, Fan-Out Wafer Level Packaging [FOWLP] is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound forming a reconfigured wafer. A thin film redistribution layer is applied on the reconfigured wafer routes the die pads to the space around the die on the mold compound (fan-out). After solder ball placement and package singulation by dicing...
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