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This paper presents a low temperature (200??C) CMOS-compatible fabrication process for integrating high-temperature deposited lead zirconate titanate (PZT) on thin film monocrystalline-silicon piezoelectric actuators, onto an RF substrate, and successful demonstration of this process for fabrication of metal-contact RF-MEMS switches. The patterned PZT/silicon multi-layer stack is transfer-bonded from...
This paper reports on a microelectromechanical (MEMS) switch array embedded and packaged on a single chip. The switch array is utilized for the automated reconfiguration of the physical layer of copper-wire telecommunication networks. A total of 25 individually controllable double-switches are arranged in a 6.7 times 6.4 mm2 large 5 times 5 switch matrix allowing for any configuration of independently...
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