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This paper presents a new methodology for analog circuits design which takes into account layout dependent effects and layout interdependencies between devices. Analog Devices' performance is impacted by other layout features located in near context. These layout effects can lead to catastrophic failures in analog circuits. The new introduced methodology helps Analog designers to determine the effect...
This paper proposes a novel convertible unified power quality conditioner (CUPQC) by employing three voltage source converters (VSCs) which are connected to a multi-bus/multi-feeder distribution system to mitigate current and voltage imperfections. The control performance of the VSCs is characterized by a minimum of six circuit open/close switches configurable in a minimum of seventeen combinations...
This paper proposes a novel custom power controller named as generalized unified power quality conditioner (GUPQC) based on cascade multilevel converter (CMC) for power quality improvement of a distribution system by using both five-level and three-level CMC. In a multi-bus, three independent feeders distribution system, the load reactive power and current harmonics of one feeder are compensated by...
In this paper a novel structure of a generalized unified power quality conditioner (GUPQC) which is a combination of one shunt and two series voltage source converters (VSCs) connected among three independent distribution feeders is presented. It compensates current imperfections in one feeder and voltage imperfections in the other two feeders. The proposed design of GUPQC enhances the power quality...
HWMP, the default routing protocol of IEEE 802.11s has been revised during the comment resolution of the first letter ballot. The paper gives an update on three areas where major changes have been introduced to HWMP: support for interworking with other networks; revised concept for proactive routing trees to root MPs; and a better aligned extensible path selection framework.
In order to guarantee a good solder reliability, the choice of soldering partners is crucial. With the on-going reduction of dimension of solder joints, intermetallic phase formation becomes an issue for the long-term-stability. The intermetallics can be mostly observed after soldering. Especially lead-fee solders are well-known for fast reaction by needle-shape forming intermetallics as well as by...
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