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According to the fact that heating will affect the image collection, target identification and track, so it will affect the alignment precision of the chips and substrates in the process of chips package. Sequence images were collected through the thermosonic flip-chip bonder under the different heating temperature, their parameters distribute regulation of translation, scale ,rotation under the influence...
Thermosonic flip chip bonding has been widely used in fine pitch IC packaging for its unique features. By using thermosonic flip chip bonding at an aluminum wire bonder, 1 mm*1 mm chip with 8 gold bumps is bonded successfully to Ag substrate, and the bonding strength reaches as high as about 30gf/bump. Dynamical characteristics of ultrasonic transducer are investigated by finite element method and...
In ultrasonic wire bonding, many factors influence the bonding quality. This article discussed the influence on the bonding quality at different capillary mounted length conditions. Experiment results show that bonding strength, current and voltage will differ at different mounted length of the capillary. The results of this article may be reference for the selection of the capillary mounted length...
The optical methods provide noncontact whole-field information with various sensitivities and resolutions. They include moire interferometry, Twyman/Green interferometry, and shadow moire, etc. This is a brief illustrative about our research by using optical methods for microelectronics and optoelectronic packaging. Some practical optical image methodologies for deformation assessment were modified...
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