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Parameter-specific ring oscillator (RO) experimental results are reported, demonstrating the ability to electronically distinguish and quantify sources of variations from gate lithography focus, gate-to-active overlay, nitride contact etch stop layer (CESL) strain, and Shallow Trench Isolation (STI) stress. A 2% RO frequency change due to gate focus variations, a three-four nm overlay error, a 20%...
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