The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Chip-scale package (CSP) is commonly seen on high density boards as it minimizes the foot print while packed more functionality into one component. Board level reliability concern over CSPs is that finer pitch limits the solder ball size attached and the stencil thickness used in assembly which leads to much smaller joint volume and standoff while larger die-to-package ratio typically means higher...
The conversion to Pb-free solders has already been implemented in the consumer market. However, the transition to Pb-free solders in the high performance, mission critical networking/server industry has not yet been fully implemented. A significant factor in the slow transition to Pb-free solders is the absence of industry accepted Pb-free acceleration transforms that can translate lab test results...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.