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3D integration has new manufacturing and design challenges such as timing corner mismatch between tiers and device variation due to Through Silicon Via (TSV) induced stress. Timing corner mismatch between tiers is caused because each tier is manufactured in independent process. Therefore, inter-die variation should be considered to analyze and optimize for paths spreading over several tiers. TSV induced...
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with pre-bond testability because designers can avoid stacking defective dies with good ones. However, pre-bond testability presents unique challenges to 3D clock tree design. First, each die needs a complete 2D clock tree for the pre-bond testing. In addition, the entire 3D stack...
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