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We describe the design, fabrication and results of passivated contacts to n-type silicon utilizing thin SiO2 and indium tin oxide. High-temperature silicon dioxide is grown on both surfaces on an n-type Si wafer to a thickness <50 Å, followed by deposition of tin-doped indium oxide (ITO) and a patterned metal contacting layer. As deposited, the thin-film stack has a very high recombination parameter,...
We describe the design, fabrication and results of passivated contacts to n-type silicon utilizing thin SiO 2 and transparent conducting oxide layers. High temperature silicon dioxide is grown on both surfaces of an n-type wafer to a thickness <50Å, followed by deposition of tin-doped indium oxide (ITO) and a patterned metal contacting layer. As deposited, the thin-film stack has a very...
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