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Convective heat transfer from a vertically stacked [3-D] electronic package (die-stacking) mounted in between two circuit boards is numerically investigated. Heat transfer characteristics of single chip packages and multiple-die packages for both two and four die stack are presented and compared. The package Reynolds number, based on the package height and upstream velocity, ranges from 150 to about...
Convective heat transfer from a vertically stacked (3D) electronic package (package-on-package) mounted in between two circuit boards is numerically investigated. Heat transfer and pressure loss characteristics of single chip packages and multiple-chip packages (P-O-P) for both two and four package stack are presented and compared. The package Reynolds number, based on the package height and upstream...
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