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Chips manufactured with deep sub micron technologies are prone to large process variation and temperature-dependent defects. In order to provide high test efficiency, the tests for temperature-dependent defects should be applied at appropriate temperature ranges. Existing static scheduling techniques achieve these specified temperatures by scheduling the tests, specially developed heating sequences,...
High temperature and process variation are undesirable phenomena affecting modern Systems-on-Chip (SoC). High temperature is a well-known issue, in particular during test, and should be taken care of in the test process. Modern SoCs are affected by large process variation and therefore experience large and time-variant temperature deviations. A traditional test schedule which ignores these deviations...
High working temperature and process variation are undesirable effects for modern systems-on-chip. It is well recognized that the high temperature should be taken care of during the test process. Since large process variations induce rapid and large temperature deviations, traditional static test schedules are suboptimal in terms of speed and/or thermal-safety. A solution to this problem is to use...
High temperature and process variation are undesirable effects for modern systems-on-chip. The high temperature is a prominent issue during test and should be taken care of during the test process. Modern SoCs, affected by large process variation, experience rapid and large temperature deviations and, therefore, a traditional static test schedule which is unaware of these deviations will be suboptimal...
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