Search results for: Yufeng Jin

Items from 1 to 20 out of 179 results

article

P‐77: A Novel Frequency Doubling Technology with Adaptive Dither

Qian Wang, Simin Zhai, Yaoming Guo, Weipeng Liao, more

SID Symposium Digest of Technical Papers > 55 > 1 > 1676 - 1679

In this paper, in order to improve the refresh rate of large‐size LCD displays, a new optimized driving scheme combined with new GOA timing is implemented in hardware platform, which is called adaptive scanning for frequency multiplication (ASF) technology, and it can be applied to TV, MNT, NB and other fields. Firstly, this paper introduces the basic principle of Dual Line Gate technology (DLG),...

article

P‐126: Research on adaptive voltage regulation algorithm on TFT‐LCD

Shijie Deng, Qiang Wang, Yufeng Jin, Yu Wu

SID Symposium Digest of Technical Papers > 55 > 1 > 1877 - 1880

In the current global promotion of environmental protection and low‐carbon, in order to further reduce the power consumption of TFT‐LCD, this paper proposes an algorithm based on image detection for adaptive adjustment of panel voltage, and tests the algorithm on the monitor. The test results shows that the algorithm can achieve power reduction while maintaining image quality.

article

50‐2: Research on adaptive voltage regulation algorithm on TFT‐LCD

Shijie Deng, Qiang Wang, Yufeng Jin, Yu Wu

SID Symposium Digest of Technical Papers > 55 > S1 > 443 - 446

In the current global promotion of environmental protection and low‐carbon, to further reduce the power consumption of TFT‐ LCD, this paper proposes an algorithm based on image detection for adaptive adjustment of panel voltage and tests the algorithm on the monitor. The test results shows that the algorithm can achieve power reduction while maintaining image quality.

article

14.2: 32 Inch Remote Interactive LCD Display by Using Amorpous Silicon as Photo Sensor

Lei Wen, Yufeng Jin, Yang Rao, Luyun Huang, more

SID Symposium Digest of Technical Papers > 52 > S2 > 196 - 196

article

Impact of E‐Mode Gallium Nitride High Electron Mobility Transistor with P‐Type Gate on Waveform Distortion in an AirFuel Wireless Power Transfer System

Shaoyu Sun, Jianshan Zhang, Ling Xia, Wengang Wu, more

physica status solidi (a) > 218 > 3 > n/a - n/a

A wireless power transfer system using commercial lateral gallium nitride (GaN)‐based high electron mobility transistor (HEMT) is studied. Waveform distortions from an ideal class‐D zero‐voltage switching topology are observed. A special method is presented to accurately measure the dynamic resistance in the nanosecond scale. The origin of distortions is traced back to both the circuit and device...

article

Impact of E‐Mode Gallium Nitride High Electron Mobility Transistor with P‐Type Gate on Waveform Distortion in an AirFuel Wireless Power Transfer System

Shaoyu Sun, Jianshan Zhang, Ling Xia, Wengang Wu, more

physica status solidi (a) > 218 > 3 > n/a - n/a

Wireless Power Transfer In article number 2000565 by Yufeng Jin and co‐workers the reliability of GaN device in wireless power transfer system is studied. The wireless power transfer system module is at the bottom left of the picture. The authors study the reliability of the device in the system from two directions, device‐level and circuit‐level. The GaN device’s structure is shown at bottom right...

article

60‐4: Implementation and Optimization of FSRCNN‐s Algorithm Based on SDSoC Platform

Yanan Ji, Dalton Lai, Yufeng Jin, Yin-Hung Chen, more

SID Symposium Digest of Technical Papers > 51 > 1 > 901 - 904

In this paper, traditional FSRCNN‐s algorithm is implemented in hardware platform. The weights of the algorithm are quantified to improve the processing speed and keep the effect. The SDSoc platform is used as the hardware accelerator, and the improved FSRCNN algorithm is optimized again on this platform.The process of hardware optimization includes adjustment of algorithm structure, optimization...

article

P‐35: Applying HVS Model to Construct SPR Algorithm for PenTile RGB Display

Baojun Wang, Yufeng Jin, Ching-Hong Lai, Yin-Hung Chen, more

SID Symposium Digest of Technical Papers > 51 > 1 > 1482 - 1485

This paper focuses on the design and simplification computation of the optimal filter based on the HVS model for PenTile RGB. After simplifying, the proposed method is also easy to implement in hardware. Simulation results show that the optimal filter obtained by mathematical optimization can suppress the color fringing artifacts and improve apparent resolution.

article

P‐5.12: Training Multi‐scale Networks for Compression Artifacts Reduction

Yufan Deng, Yufeng Jin, Yinhung Chen, Bin Zhao

SID Symposium Digest of Technical Papers > 50 > S1 > 746 - 749

Present a multi‐scale neural network for compression artifacts reduction. The optimized structure and training procedure can lower the difficulty of convergence and speed up training. Experimental results show that our network outperforms other networks, and can remove complex noise in various sizes, generating cleaner images.

article

P‐4.7: Image Enhancement with Visual Saturation Preserving on Adaptive Histogram Model

Chaochao Shi, Yufeng Jin, Yinhung Chen, Bin Zhao

SID Symposium Digest of Technical Papers > 50 > S1 > 716 - 719

A novel algorithm based on histogram equalization (HE) is proposed, which has saturation preservation and obtain more suitable visual perception. This method can solve the problem of visual perception saturation decrease and color distortion caused by conventional histogram methods. The results show excellent performance in LDR image enhancement.

article

22‐1: Image Enhancement with Visual Saturation Preserving on Adaptive Histogram Model

Chaochao Shi, Yufeng Jin, Yinhung Chen, Bin Zhao

SID Symposium Digest of Technical Papers > 50 > 1 > 299 - 302

article

8‐2: Training Multi‐Scale Networks for Compression Artifacts Reduction

Yufan Deng, Yufeng Jin, Yinhung Chen, Bin Zhao

SID Symposium Digest of Technical Papers > 50 > 1 > 85 - 88

article

Parylene-MEMS technique-based flexible electronics

Xiao Dong, Meixuan Zhang, Yinhua Lei, Zhihong Li, more

Science China Information Sciences > 2018 > 61 > 6 > 1-9

This paper reports a novel fabrication strategy for flexible electronics based on the parylene-MEMS (micro-electromechanical system) technique. A set of parylene-filled trenches is used to mechanically connect silicon-based functional units and realize a flexible 4×6 temperature controlling array as a preliminary demonstration. The trench-filling performance of the parylene deposition is carefully...

article

Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC

Yudan Pi, Ningyu Wang, Jing Chen, Min Miao, more

International Journal of Heat and Mass Transfer > 2018 > 120 > C > 361-378

The complexity of thermal management increases as integrated circuits evolved into 3D architectures. Because of the large variation that exists in the thermal conductivity of materials and the geometrical size of structures in the 3D-stacked IC (3D-SIC) network, the extensive computational costs typically render a full-chip-scale numerical simulation impossible. Thus, this paper proposes a fast and...

article

Effect of Radiation on Reliability of Through-Silicon via for 3-D Packaging Systems

Qinghua Zeng, Jing Chen, Yufeng Jin

IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 708 - 712

In this paper, radiation reliability of through-silicon via (TSV) was studied experimentally. Characterization of leakage current between adjacent TSVs and capacitance of an array of TSVs was used to evaluate the effects of radiation on reliability of TSVs. All samples were exposed to ⁶⁰Co

${\gamma }$

radiation with a total radiation dose of 500 Gy. It was observed that leakage current increased...

article

Schottky-MOS Hybrid Anode AlGaN/GaN Lateral Field-Effect Rectifier With Low Onset Voltage and Improved Breakdown Voltage

Jingnan Gao, Maojun Wang, Ruiyuan Yin, Shaofei Liu, more

IEEE Electron Device Letters > 2017 > 38 > 10 > 1425 - 1428

For devices with a 15 micron anode-to-cathode distance, nearly 1.5 times increase in the blocking (breakdown) voltage (from 692 to 1030 V) has been achieved by replacing the alloyed Ohmic contact at the anode electrode of the conventional MOS gated hybrid-anode lateral field-effect rectifier (CMLFER) with a low barrier Schottky contact. The new Schottky-MOS hybrid-anode lateral field-effect rectifier...

chapter

Effect of annealing process on the properties of through-silicon-via electroplating copper

Yong Guan, Qinghua Zeng, Jing Chen, Wei Meng, more

2017 18th International Conference on Electronic Packaging Technology (ICEPT) > 139 - 142

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

This paper focuses on the influence of annealing process on the properties and microstructural evolution of through-silicon-via electroplating copper. Particular attention is paid to the interposer-related through-silicon-via applications, which is fabricated by via-last process with the diameter of 20 microns and above. A interposer was designed and fabricated with its diameter of 100 microns and...

chapter

Fabrication of the micromachined poly-dimethylsiloxane pyramidal tips arrays for biotechnology packaging applications

Yong Guan, Qinghua Zeng, Jing Chen, Wei Meng, more

2017 18th International Conference on Electronic Packaging Technology (ICEPT) > 162 - 164

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

This article presents a simple, non-toxic, and low-cost tips arrays made of poly-dimethylsiloxane pyramidal material, which is expected to have a large-scale application in the future civil biomedical field. A layer of silica and silicon nitride are grown on the silicon wafer as a corrosion mask by thermal oxygen and low pressure chemical vapor deposition process, sequentially. After lithography process,...

article

Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond

Songfang Zhao, Lingzhi Guo, Jinhui Li, Ning Li, more

Small > 13 > 28 > n/a - n/a

Recently, stretchable electronics have been highly desirable in the Internet of Things and electronic skins. Herein, an innovative and cost‐efficient strategy is demonstrated to fabricate highly sensitive, stretchable, and conductive strain‐sensing platforms inspired by the geometries of a spiders slit organ and a lobsters shell. The electrically conductive composites are fabricated via embedding...

article

Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Yong Guan, Yunhui Zhu, Shenglin Ma, Qinghua Zeng, more

IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 7 > 1011 - 1019

This paper develops a bumpless wafer-on-wafer (WoW) memory integration approach in order to increase its throughput and reliability without sacrificing the electrical and mechanical performances compared to the bump-containing chip-on-chip (CoC) integration. The features are that through silicon vias are bottom–up filled after multilayer wafers bonding and connected to the predeposited redistribution...

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INFONA - science communication portal

Search results for: Yufeng Jin

P‐77: A Novel Frequency Doubling Technology with Adaptive Dither

P‐126: Research on adaptive voltage regulation algorithm on TFT‐LCD

50‐2: Research on adaptive voltage regulation algorithm on TFT‐LCD

14.2: 32 Inch Remote Interactive LCD Display by Using Amorpous Silicon as Photo Sensor

Impact of E‐Mode Gallium Nitride High Electron Mobility Transistor with P‐Type Gate on Waveform Distortion in an AirFuel Wireless Power Transfer System

Impact of E‐Mode Gallium Nitride High Electron Mobility Transistor with P‐Type Gate on Waveform Distortion in an AirFuel Wireless Power Transfer System

60‐4: Implementation and Optimization of FSRCNN‐s Algorithm Based on SDSoC Platform

P‐35: Applying HVS Model to Construct SPR Algorithm for PenTile RGB Display

P‐5.12: Training Multi‐scale Networks for Compression Artifacts Reduction

P‐4.7: Image Enhancement with Visual Saturation Preserving on Adaptive Histogram Model

22‐1: Image Enhancement with Visual Saturation Preserving on Adaptive Histogram Model

8‐2: Training Multi‐Scale Networks for Compression Artifacts Reduction

Parylene-MEMS technique-based flexible electronics

Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC

Effect of Radiation on Reliability of Through-Silicon via for 3-D Packaging Systems

Schottky-MOS Hybrid Anode AlGaN/GaN Lateral Field-Effect Rectifier With Low Onset Voltage and Improved Breakdown Voltage

Effect of annealing process on the properties of through-silicon-via electroplating copper

Fabrication of the micromachined poly-dimethylsiloxane pyramidal tips arrays for biotechnology packaging applications

Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond

Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

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