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Stacked die package using capacitive-based chip-to-chip signaling offers low energy-per-bit costs and high I/O density. Many previously published works on capacitive proximity I/O have focused on mechanical methods for accurate chip alignment. This paper explores design considerations to address stacked die structures with differential signaling chip-to-chip communication based on capacitive coupling...
A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. This paper describes a loopback architecture suitable for testing three-dimensional integrated circuit (3D...
A three-dimensional system-in-package (3-D SiP) based on silicon carriers or an interposer is a fast-emerging technology that offers system design flexibility and the integration of heterogeneous technologies. A passive interposer, which is a way to bridge the feature gap between the integrated circuit (IC) and the package substrate, is a key building block for high performance 3-D systems. The need...
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