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The solder joints between Cu/Sn-40Pb/Cu lead solder and Cu/Sn-9Zn/Cu and Cu/Sn-8Zn-3Bi/Cu lead-free solders were studied. The study focuses upon the formation of interface intermetallic (IMC), adhesive strength of the joints and the fracture morphology of the as-soldered soldered joints. For Sn-40Pb, Cu 6 Sn 5 IMC was formed. For Sn-9Zn and Sn-8Zn-3Bi solders, two layers were detected...
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