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The degradation of packaged GaN HEMTs for high power applications has been studied under long term reverse bias step stress tests. Increases of leakage current and dynamic Ron resistance have been found. This degradation is possibly caused by the formation of localized defects which have been observed by backside electroluminescence imaging. In addition the effect of device layout and substrate material...
Recent DC- and RF-reliability results of European GaN HEMTs for high frequency power and MMIC applications between 2 and 18 GHz will be presented. The DC-stress test experiments have been performed at high current and high voltage settings in order to test the devices in the different regimes during large signal operation. GaN HEMTs and one stage MMICs have also been tested under RF-operation conditions...
In this work, device reliability under DC- and RF-operation at high temperatures ranging from 140degC to 200degC and at high drain voltage of 50 V has been achieved by improving the gate metal processing technology. It will be shown by long term stress tests that the gate processing technology is the key to improve the stability of the gate leakage current. The short term drain voltage robustness...
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