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The mechanical strength of Sn-3.0Ag-0.5Cu (SAC305) and Au-20Sn solder joints and their interfacial reaction with a Ni-plated ceramic substrate were evaluated to assess their suitability for use as die attach materials in power module applications. The compatibility between the two solder alloys and the Ni substrate was assessed during isothermal long-term aging, while the mechanical strength of the...
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