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Flip chip solder bump has been widely used in the electronics industry in recent years as high performance and miniaturized electronics have become more common. Microbump is one of candidates to solve reliability issues because it provides the fine pitch and uniform current distribution. However, electromigration of the microbump has recently been an important reliability issue of flip chip packages...
The effect of interfacial microstructures on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder bumps with respect to the loading speed, annealing time, and surface finish was investigated. The shear force increased and the ductility decreased with increasing shear speed, primarily because of the time-independent plastic hardening and time-dependent strain-rate sensitivity of the solder alloy...
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