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This paper is focused on the Wind Energy (WE) systems and Wind Farms (WFs) optimization in Luxembourg. It describes the overview of the wind resources in all the WFs and presents a class of Improved Wake Interaction Model (IWIM) for Coordination and Optimization Control (CnOC) of WFs. Based on Wind Power (WP) assessment of WFs, the statistical method is used to model the distribution of Wind Speed...
Capacitive touch screens have become an integral component of our everyday lives, from smartphones and tablets to wearable devices, smart-home devices, smart automobiles, entertainment on airplanes, and even in public places such as hotels or shopping malls. As alternative transparent conductive materials to traditional Indium Tin Oxide (ITO) are considered, silver nanowires are among the nanomaterials...
A good solution to meet the need of miniaturization and low cost for micro-electronics packaging is wafer level package technology. But thermal mechanical reliability problem which generated from the coefficient of thermal expansion (CTE) mismatch between the chip and the PCB limit the application of larger size wafer level package. To solve this problem, the prototype of compliant package is proposed...
Along with electronic products developing toward lighter, thinner, and multi-functional integration, chip scale package (CSP) has been widely used in electronic packages. Wafer level packaging (WLP) has become one dominant technology. However, applications of WLP are limited by solder joint fatigue due to stress generated by the CTE mismatch among different materials. Compliant wafer level packaging...
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