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In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
In this study, phase transformations at the interfaces between two nearly mutually insoluble elementary substances, In-48Sn solder and Cu, were investigated during serial solid-state aging process. The reversible phase transformation between Cu2(In, Sn) and Cu(In, Sn)2 compounds were observed, which are extremely rare to occur in one and the same system. The corresponding interfacial reactions were...
The interfacial microstructure and Kirkendall voids between eutectic SnIn and polycrystalline Cu substrate was investigated after reflowing and long-term solid-state aging process. The results indicated that two crystal-structure IMC species: Cu(In, Sn)2 phase existing at the solder side and Cu2(In, Sn) phase locating at the Cu side, among which Cu2(In, Sn) phase with two different morphologies, the...
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