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This paper presents analyses related to thermal model order reduction based on the Krylov subspaces methodology. The research is carried out for the three-dimensional structure in the form of the cube. In order to determine the temperature distribution inside the structure, the Dual-Phase-Lag heat transfer model of the second order is employed. Then, the methodology of the model order reduction is...
Due to technology scaling and increasing power density thermal issues in today's VLSI integrated circuits are of very high importance. Nowadays, more than a half of IC failures is caused by exceeded heating of a semiconductor structure. Therefore, it is necessary to constantly develop accurate methods capable of predicting temperature profile inside the chip structure. We propose a model to obtain...
This article is an extension of the work presented earlier, which compared and analyzed the economics of alternative maintenance plans. The proposed model combines genetic algorithms with Monte Carlo simulation to arrive at the most economic investment timing. The approach described earlier was characterized by a very long computing time making it difficult to use. This paper addresses several issues...
The aim of This work is to introduce the new approach of modelling, simulation and design of the sigma-delta converters using VHDL-AMS language. The two main structures of the analogue to digital converters are presented. First solution refers to the description of the 8-bit sigma-delta converter in VHDL-AMS language. On the basis of such approach the advantages and disadvantages are discussed. The...
In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several...
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