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A series of impact tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu are performed with a wide range of strain rates to get the valid dynamic model parameters input for modeling. By using a split Hopkinson pressure bar (SHPB) experimental system, dynamic stress-strain characteristics data of 95.7Sn3.8Ag0.5Cu are measured. Comparison of the dynamic test data with the quasi-static test data shows that...
This paper studies the numerical simulation method for electromigration in the solder joint of a chip scale package. The three dimensional electromigration finite element model for solder joint reliability is developed. Numerical experiments are carried out to obtain the electrical, thermal and stress fields with the migration failure under high current density loads. The indirect coupled analysis...
This paper studies the numerical simulation method for electromigration in IC device and solder joint in a package under the combination of high current density, thermal load and mechanical load. The three dimensional electromigration finite element model for IC device/interconnects and solder joint reliability are developed and tested. Numerical experiment is carried out to obtain the electrical,...
A series of tensile tests for pb-free solder material 95.5Sn4.0Ag0.5Cu are conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of the Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as a functions of temperature. It is found that the...
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