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An enhanced finite element modeling methodology based on commercial software ANSYS Multi-physics and FORTRAN code is developed for the simulation of electromigration. The electronic migration formulation taking into account the effects of the atomic concentration gradient (ACG) has been developed to show the difference in the electromigration (EM) failure mechanisms. An improved algorithm of total...
A series of tensile tests for Pb-free solder material 95.7Sn3.8Ag0.5Cu have been conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as the functions of temperature. It is found that...
Handheld electronic products are more prone to being dropped during their lifetime of use. Therefore, the reliability performance of these products during a drop impact has become a concern. Although a new board level test method has been standardized through JEDEC (JESD22-B111). characterization tests are usually expensive and time consuming to complete. In order to reduce costs and the design cycle,...
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