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With the current trend of less expensive, faster, and better electronic products, it has become increasingly important to evaluate the IC package and system performance early in the design stage using simulation tools. For the solder joint subjected to cyclic stresses generated during the thermal cycling, its reliability depends on its resistance to creep and fatigue. The approach for simulation in...
A series of tensile tests for pb-free solder material 95.5Sn4.0Ag0.5Cu are conducted under a wide range of temperatures and constant strain rates to obtain the required data for fitting the material parameters of the Anand model. Based on these test results, empirical equations of the tensile strength, elastic modulus and yield stress are fitted as a functions of temperature. It is found that the...
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