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The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10days at 120°C and 170°C, respectively, and then loaded to failure in shear with a constant loading speed of 5×10 −3 mm/s. The growth of the interfacial Cu–Sn intermetallic compounds (IMC) layer (Cu...
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