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The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
Interfacial intermetallic compound (IMC) is a important factor for the reliability of soldering joints. Too thick intermetallic compounds layer will reduce the reliability of soldered joints seriously. And stable intermetallic compound Cu6Sn5 phase initially formed at the interface after reflowing is necessary for good quality of soldering joints. In the present study, scallop-like Cu6Sn5 was used...
The present work evaluated the board level reliability of a kind of wafer-level chip-scale packaging (WLCSP). Drop impact tests were conducted to evaluate the lifetime and failure mode of the components before and after thermal cycles from −55 to 125 °C (50, 100, 150 temperature cycles) and high temperature (125 °C) storage (50 h, 100 h, 150 h). Under the peak acceleration of 1500 g and pulse duration...
The relationships between the morphology of Ag3Sn phases and the cooling rate, solder volume and 0.7 wt.% Cu addition into Sn-3.5Ag solder were investigated in this study. The morphology of Ag3Sn phases in the solder joints was greatly affected by the cooling rate. In Sn-3.5Ag/ENEPIG (electroless nickel electroless podium immersion gold) solder joints, large plate-like Ag3Sn phases formed on the interfacial...
The absorption behavior of Ag3Sn particles on the surface of intermetallic compounds (IMCs) formed at Sn-3.5Ag-xCu/Cu (x=0, 0.7, 1.5 wt. %) interfaces was studied. The Sn-3.5Ag-xCu/Cu solder joints were prepared by reflow soldering at 260degC for different time. The X-ray diffraction results showed that the dominant IMCs formed at Sn-3.5Ag-xCu/Cu interfaces were Cu6Sn5. For Sn-3.5Ag/Cu and Sn-3.5Ag-0...
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