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We have demonstrated the complete copper filling of contact structures at 32 nm- and 22 nm-node dimensions with the conventional PVD only Ta(N)/Cu barrier/seed process. Copper seed process was optimized to obtain the sufficient coverage of copper along the contact hole with the sufficiently wide gap opening at the top by the use of the directional sputtering and the re-sputtering techniques. In addition,...
We have directly measured two-dimensional (2-D) dopant profiles of millisecond-annealed p-MOSFETs by scanning spreading resistance microscopy (SSRM) for the first time. The measured 2-D dopant profiles agree with simulated dopant profiles obtained by using calibrated TCAD tools. Three-dimensional (3-D) SSRM simulation reveals that the current SSRM probe-contact radius has enough spatial resolution...
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