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The higher stiffness of Pb-free SAC solders makes Pb-free assemblies more sensitive to drop impact. In order to be able to optimize the drop test performance, it is necessary to have better insight into the crack propagation in the Pb-free solder joints. This study combines crack-front mapping using the dye and pry method and electrical FE simulation to establish a relation between DC electrical resistance...
With the ever-growing number of MEMS resonator applications, an research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator. Packaging has proven to be a problem and this research focuses on the backgrinding of wafers. Backgrinding introduces a tape application and removal step on the active side of the wafer. This paper shows...
In the growing MEMS market wafer level thin film packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing,...
It is known that molding compounds, containing irregularly shaped filler particles, used in microelectronic devices can cause damage within the diffusion stack. Electrical shorts between the top two metal layers often manifest this phenomenon. Such effects are usually seen in non-planarized diffusion processes due to their relatively larger irregularity in topography. The main factors that control...
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