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A wafer-level-packaging technology is proposed to realize small SAW filters with low profiles that are resistant against transfer molding. Structural design considerations are described as well as the experimental results. It is shown that the proposed WLP SAW filters are suitable for the applications to RF front-end modules which are transfer molded with ICs.
Very small SAW filters of the size 0.8 mm x 0.6 mm based on wafer-level packaging technology are fabricated and tested. Excellent electrical performance as well as robustness against humidity and mechanical stress are demonstrated. Complete devices are fabricated on a wafer, instead of bonding with a ceramic substrate or another wafer. A structure with a hollow space is built on the piezoelectric...
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