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The formation behaviour of grains and their components, including Sn dendrites, Cu 6 Sn 5 and Ag 3 Sn intermetallic compounds (IMCs), in a SnAgCu alloy is investigated in an experiment in which it was possible to obtain the solid reactants directly from the liquid solder during the liquid–solid phase transformation. The results show that Cu 6 Sn 5 IMCs are formed...
The initial formation of SnCu intermetallic compounds (IMCs) between a molten SnAgCu alloy and Cu under-bump metallization is observed by removing the liquid solder from the substrate and rapidly cooling just as the interfacial IMCs are forming. The results show that a Cu 3 Sn layer is formed ahead of the liquid solder on the Cu substrate. The liquid solder subsequently spreads on this existing...
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