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Through silicon via (TSV) based 3DIC has allowed vertical integration of multiple dies for wide I/O configuration. With thousands of TSVs, data transfer rate can be reduced, while maintaining the highest bandwidth compared to the systems in conventional integrated chips and packages. The challenges lie on high yield fabrication process. The trend in dimension of TSV is continuously decreasing, which...
In this paper, eye-diagrams of coupled microstrip channel on Printed Circuit Board (PCB) are estimated using equivalent circuit model. The equivalent circuit model has RLGC terms which are calculated from the physical dimensions of the coupled microstrip channel. Since the coupled microstrip channel is modeled by physical dimensions, eye-diagrams are estimated without 3D Full EM simulation, which...
The feasibility of designing and modeling a multistage depressed collector (MDC) using 3D conformal finite-difference time-domain (CFDTD) particle-in-cell (PIC) simulations as implemented in VORPAL has been studied. A simple circuit model employing feedback mechanisms has been implemented to provide stable time-dependent voltages for each stage of the depressed collector and an arbitrary space-time...
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