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As technology develops, the number of chips increases while the thickness of mobile products continuously decreases, which leads to the need for high-density packaging techniques with high numbers of power and signal lines. By applying wireless power transfer technology at the printed circuit board (PCB) and package levels, the number of power pins can be greatly reduced to produce more space for...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.