The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper reports a method of measuring the on-chip thermal stress for silicon resonant accelerometer (SRA). This method could be used to evaluate the stress-temperature characteristic of SRA, and that would help to focus the problems exist in SRA. Clamp-clamp Double Ended Turning Fork resonator is used as a basic measurement unit. Analysis of the accuracy and noise in stress measurement is given...
The silicon microgyroscopes are very sensitive to the residual stresses, which degrade the microgyroscopes performance. This study used finite element analysis to simulate the residual stresses induced during the packaging process. The silicon microgyroscope is fabricated with SOG (silicon-on-glass) technology and packaged with ceramic packages. FEM simulation based on a simplified structure of the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.