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High-throughput manufacturing of complex 3D architectures for microscale products such as microelectronics is limited by the resolution of existing additive manufacturing processes. This paper presents experimental testing and validation of the major subsystems in a microscale selective laser sintering (µ-SLS) process that is capable of fabricating true-3D metallic micro-architectures with microscale...
Copper nanoparticles (NPs), due to their high electrical conductivity, low cost, and easy availability, provide an excellent alternative to other metal NPs such as gold, silver, and aluminum in applications ranging from direct printing of conductive patterns on metal and flexible substrates for printed electronics applications to making three-dimensional freeform structures for interconnect fabrication...
This study investigates the interface thermal conductance in a functionalized carbon nanotube (CNT)–epoxy composite system and how it is modified when the surrounding matrix is cured. We have used nonequilibrium molecular dynamics simulations to study the interface thermal conductance in both cured and uncured matrices, based on diglycidyl ether of bisphenol F (EPON-862) and diethylenetoluenediamine...
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