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Since the invention of the integrated circuit increasing transistor integration density has been the main path to increased performance of microelectronic devices. With traditional transistor scaling approaching fundamental limitations, the field of electronic packaging has seen increasing effort towards increased integration density, e.g. three-dimensional packaging. Overall, this has led to tremendous...
Conductive adhesives are generally considered to be one of the strongest candidates for replacement of solder in electronics industry. However, some problems related to the performance have so far limited wider applications of conductive adhesives. One of the major problems is tendency to degrade during temperature and humidity aging. In this paper, two kinds of Isotropic Conductive Adhesives (ICA)...
Previous studies have discovered a unique type of nanostructured polymer-metal composite for thermal interface material with effective thermal conductivity of 8 W/mK. It is a promising result but extensive efforts are still required to further enhance the thermal conductivity. Therefore, this paper will try to help the process with modeling and simulation. Calculations reveal the alignment of the...
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