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In this paper, a novel radio frequency (RF) induced power supply system for micro sensor nodes is presented. Supplied power in RF-electromagnetic wave is received and rectified in each micro sensor device. A charge pump (CP) circuit boosts up an output voltage of the received power, and stores the energy in a large capacitor. When the boost up voltage of CP circuit reaches to an arbitrary voltage,...
This paper reports about a novel wafer-level integration technique of discrete surface mount devices (SMDs). It enables wafer-level mounting of plural kinds of SMDs on a silicon (Si)-wafer using vibration and gravity force. Deep holes with 400-m depth are formed on the surface of a Si-wafer by deep reactive ion etching process after general integrated circuit process for positioning of SMDs. A non-conductive...
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