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This paper reports a new post-CMOS process to integrate thick (>10 mum) SOI MEMS devices after standard CMOS process, which requires only three additional photomask steps. The additional MEMS processes are not severe and critical for the integrated CMOS devices. In this technology, high aspect ratio SOI MEMS devices and CMOS integrated circuits are electrically connected with 'micro bridge interconnection'...
In this paper, a novel concept of multi-functional MEMS tactile imager using flexible deformation of silicon IC for advanced tactile sensing applications is presented. Integration design of multi-functional tactile imager with sensing abilities of contact-force, hardness and temperature distributions is totally discussed based on their measured performances. This tactile sensor has a sensing region...
This paper presents the development of monolithically integrated RF transmitters and antennas for MEMS sensors such as accelerometers. Integrating wireless-communication ability on-chip microsensor, sensors can communicate the sensing data with information network by wireless. Integration technology of MEMS sensors, and RF-CMOS including RF passive components is requited to realize highly integrated...
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