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We have designed and fabricated a 2×4 electrochemical image sensor with CMOS signal processing circuits integrated on a single chip. Using a well-studied ferricyanide solution, a clear cyclic voltammetry curve was obtained from each working electrode of the array sensor. The external components used include a data generator and a data recorder. This sensor chip is an early prototype of a fully integrated...
Silicon smart microchips with CMOS/MEMS technology are realized for Intelligent sensing. In our developed chips, new type sensor chips for bio-medical applications are presented especially here. One is Si microprobe electrode and tube array chips for recording of neurons in the tissue and drug deliver use. The probe array can be fabricated on IC chip, using standard IC process followed by a selective...
Bumpless interconnect of 6-mum-pitch Cu electrodes was realized at room temperature with the surface activated bonding (SAB) method. In this study, we propose a novel bumpless structure, where the electrodes and a surrounding Cu frame are fabricated with the same height to increase bond strength and demonstrate the feasibility of a sealing interconnection between Cu surfaces. The damascene process,...
This paper reports the high-yield growth of p-Si microprobe arrays at low temperature by using Au-catalyzed selective vapor-liquid-solid (VLS) growth using in-situ doping VLS growth using Si2H6 only gives intrinsic Si microprobes, which could be doped by diffusion process (at 1100degC) after VLS growth. But in this work we have demonstrated that by incorporating in-situ doping using the gas source...
This paper reports on the development of neural recording chip device with penetrating Si microprobe electrode array using IC-process. The Si microprobe electrode array each with a few microns in diameter was grown at predetermined positions with interconnection-wirings. Controlling the diameter and the length of Si probes can be realized by a selective vapor-liquid-solid (VLS) growth. In this work,...
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