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An ultra-broadband mixer with I–Q outputs is proposed and analyzed in this paper. The mixer is composed of a distributed amplifier, a traveling wave power splitter and two active mixers where the input capacitors are absorbed in the artificial transmission lines. The orthogonal LO inputs are fed to the mixers via an on-chip Lange coupler. With the aid of loss compensation techniques, the proposed...
This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement...
In this paper, a novel 60 GHz flip-chip bandpass filter in standard CMOS technology is proposed. An insertion loss of 0.69 dB/mm for microstrip line is obtained at 60 GHz by using cascaded THRU de-embedding method. By deploying the gap between the flip-chip bump and the flipped chip, an end-coupled, half-wavelength resonator filter is designed and fabricated. The measured insertion loss of 3.3 dB...
In advanced CMOS technologies, the insertion of metal dummy fills is unavoidable due to stringent metal density process requirements. Therefore existing compact models for on-chip components need to be updated to accurately account for the effect of these metal dummy fills in CMOS RFIC designs. This paper proposes a simple but accurate method to predict the microwave behavior of on-chip spiral inductors...
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