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Differential through silicon vias (TSVs) are commonly used for the differential signaling in three-dimensional (3-D) integration, which may be disturbed by the electromagnetic field of the neighboring signal/ground paths. In this paper, the equivalent circuit model of the differential TSVs is established. Then the induced noise on the differential TSVs from the neighboring single-ended and differential...
In near field wireless power transfer (WPT), the uniformity of magnetic field distribution near the transmitting coil is needed since it would affect the stability of transfer efficiency when the receiving coil is moving. In this paper, we proposed a new coil structure constructed of 3 or more spiral coils in series based on the relationship between current distribution and magnetic field distribution...
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