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The voiding behavior of mixed solder alloy systems during BGA assembly was investigated with the use of nitrogen reflow atmosphere. The solder joints were comprised of a combination of Sn62Pb36Ag2 (Sn62), Sn63Pb37 (Sn63), Sn98.5Ag1Cu0.5 (SAC105), and Sn96.5Ag3Cu0.5 (SAC305) as the solder ball or solder paste, except for SnPb solder balls with lead-free pastes. Assembly of each BGA employed a high...
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