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We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package design technique overcomes the limitation of conventional 2-D design technique in which many bonding wires...
In this paper, a novel three-dimensional (3D) RF impedance matching circuit has been designed to match the characteristic impedance of RF transmission line and reduce the reflection of RF signal. It consists of a coplanar RF transmission line array circuit and a non-coplanar termination resistor array circuit. The latter is vertically installed on the RF transmission line array circuit by soldering...
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