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We present optimisation of a nickel electroplating process in order to obtain high-resolution nanostructures. Film stress and roughness were minimised and the deposition rate was well controlled at ∼36nm/min with optimised parameters of current density, pulse period, and duty cycle. The thickness uniformity of the film was measured to be within 5% across the 9mm2 sample with an R.M.S. roughness of...
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