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Three Sn layers of different grain size were electroplated on Cu foils to investigate the effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 during aging. In the early stage, scallop Cu6Sn5 formed in three joints. For the joint with Sn layer of 2µm grain size, the Cu6Sn5 grain size was uniform and small, and the scallops had many facets. For the joints with Sn layers of 8µm...
An ambient temperature ultrasonic bonding based on Cu micro-cone arrays (MCAs) plated with thin Sn for potential application in 3D packaging is introduced. The interfacial morphology is investigated in joints bonded by this method. As the thickness of Sn layer in bonding interface was about 300nm, the best bonding quality was obtained under the condition of low pressure of 8Mpa and short time of 1s,...
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