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As one of the most promising lead-free solder candidates for electronics interconnection, eutectic Sn-Ag-Cu alloys are receiving increasing interest due to their merits of low melting temperature, solderability, and reliability. Meanwhile, solder bumping on wafers is of great significance for flip chip interconnection technology which requires fine-pitch, high density bonding for the demands of future...
A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive X-ray spectroscopy (WDS). Different morphologies of deposited...
In this paper we present the results of initial studies of a new dry film polymer, PerMX developed by Du Pont for wafer level packaging applications. PerMX is a high resolution permanent photosensitive dry film material with low temperature processing capability. Dry film is easy to deposit on large wafers compared to the liquid form materials. We have carried out initial chip scale characterization...
Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure...
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