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Inkjet printed patterns using copper nanoparticles (NPs) were sintered at 250°C under reducing atmosphere. The size of NPs covered by organic capping molecules was 5nm on average. A crack-free Cu film was obtained after sintering. The grain size of the film reached 500nm upon grain growth. However, only agglomeration of NPs was observed at the bottom of the film. The resistance was 0.88Ω on average...
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