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This study aimed to evaluate the drop reliability using Ag content and metal additives in a Sn-Ag-Cu system composition. In this study, the main compositions of the solder ball were Sn1.0Ag0.5Cu and Sn0.5Ag0.5Cu, respectively, and Ni and Co elements were additions a additive element. The PCB plating was used Cu-OSP, immersion Sn, electroplated Ni/Au, and ENEPIG (electroless Ni electroless Pd immersion...
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