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Methods for mechanical assembly can form structures with elaborate 3D configurations, and broad potential applications in advanced microsystems technologies. In article number 2100026, John D. Finan, John A. Rogers, and co‐workers demonstrate soft, transparent 3D structures designed to gently constrain organoids for studies of their mechanical properties. Measurements reveal that the effective moduli...
Recently developed methods for transforming 2D patterns of thin‐film materials into 3D mesostructures create many interesting opportunities in microsystems design. A growing area of interest is in multifunctional thermal, electrical, chemical, and optical interfaces to biological tissues, particularly 3D multicellular, millimeter‐scale constructs, such as spheroids, assembloids, and organoids. Herein,...
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