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With the trend of commercialization of through-silicon vias (TSVs) in 3D integrated microsystems, new TSVs filling processes are developed to meet the requirement of low-cost fabricating of high-electrical performance and high-thermal reliability TSVs without any voids. In this paper, Sn-based IMCs are used as the filling materials for the formation of conductive path of TSVs. The Sn-based IMCs filling...
In this paper, the reaction couples were prepared to investigate the interaction between Sn and Cu substrate with various surface finishes. The studied interfacial systems contain Sn/Ni/Ag/Cu, Sn/Ag/Cu and Sn/Cu/Ag/Cu. The corresponding surface finish, Ag or Ni layer, is about 1~2μM. In the Sn/Ni/Ag/Cu reaction, the formed phase was Ni3Sn4 at first, indicating that Sn reacted with Ni at the Sn/Ni...
Traditional method of analysis of cable tension in field is using acquisition card and PC, but this method couldn't accurately get cable tension and the work field may be not a good test environment. This is of great inconvenience to the practical application. So this paper brings forward a portable system of cable tension measurement based on DSP. The system firstly conditions and acquires signal...
Since the additives is necessary for eliminating the residual stress of the nickel structure in MEMS devices, the effect of additives on mechanical properties of electroplating nickel was studied in this paper. Two types of nickel specimens was electroplated in electrolytes with both saccharine and butynediol (type A), and only saccharine (type B), respectively. The test chips were then tested in...
A new method for manufacturing of arbitray cross section spinnerets. Application of UV-LIGA technique to fabricate the spinneret capillarys have been preliminarily discussed. Spinneret plate were deposited by electrotyping method firstly, then bond it with the outer frame using laser welding, the entire forming of spinneret is realized. The results show that the method not only can fabricate spinnerets...
Based on the idea of the extended finite element method (XFEM), a new enriched displacement function, the exponent discontinuous function is presented to simulate the discontinuous character resulted from discontinuity such as crack, interface or joint. Simultaneously, for element containing the crack tip, the triangular basis function is introduced to embody singularity of the discontinuity tip....
Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA...
Through-mask electroplating has been widely used in the fabrication of chips, BGA substrates and PCBs etc. The uniformity of plating thin-film is the major factor contributed to the reliability of the products. Currently, it is usually by setting optimum plating parameters and adopting electrochemical method to achieve the uniformity of plating. However, the problem of non-uniform distribution of...
This paper investigates the optimal control problem for a class of nonlinear composite systems. A decomposition method is first employed to transform the nonlinear composite system into certain affine nonlinear system. And then by introducing an improved successive approximation approach, approximating sequence of linear homogeneous two-point boundary value problems is constructed to approximate the...
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