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This work aims at providing a RLCG modeling ofthe 10 µm fine-pitch microbump type interconnects in the 100 MHz-40 GHz frequency band based on characterization approach. RF measurements are performed on two-port test structures within a short-loop with chip to wafer assembly using the fine pitch 10 µm Cu-pillar on a 10 Ohm.cm substrate resistivity silicon interposer. Accuracy is obtained thanks to...
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