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In this paper, the pre-heating process of the thermosonic wire bonding process was investigated. In the case of this method, the energy for the bonding process comes from three different sources: ultrasonic vibration, pressure (force) and elevated temperature. The pre-heating system contains a heating table and the sample is positioned on the top of it. In order to determine the exact temperature...
The paper presents an emerging problem in the field of electronics manufacturing, where the miniature SMD components and the large size of the panelized Printed Circuit Boards (PCBs) cause soldering failures indirectly during reflow soldering. During our investigation, the issue of PCB shrinkage was inspected, which causes linear offset problems along the lateral dimensions of the board during the...
In the modern warfare the access to the information became a primary factor to achieve military goals: we have to ensure our troops to get proper information in time, and we must thwart our enemies to use their information assets successfully. For a secure communication link we can create jam resistant and temper proof wired connections, but on the other side wireless communication will always endangered...
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